The world’s first ‘hyper-real’ pain relief device makes its debut

The world is getting ready for a new kind of pain relief, thanks to a new device designed to mimic human body temperature.

A device that can mimic human skin and skin conductivity is currently under development by the University of Colorado, and is scheduled to be unveiled at the company’s annual developer conference next week.

“We were very excited about this device,” says Chris Dyer, a postdoc at the University’s College of Engineering who is working on the device.

The device, known as a thermosensitive body skin interface, uses a thin film of silicone to mimic the skin conductance of human skin.

A small heating element heats the silicone to around 1,000 degrees Celsius.

The heat generates heat, which is then transmitted to a heat exchanger that generates a mechanical “wet” that cools the device, as shown here.

The team was able to demonstrate this process using their new device, which uses a flexible, flexible, non-stick coating that helps to keep the device from sticking to the skin.

“You can apply a lot of heat on the skin to get the right temperature, which helps the thermosensor to operate,” Dyer says.

“And that’s really exciting.

I’m actually very excited to see what happens with this in the lab.”

A device made of flexible, soft, and non-sticky silicone Thermosensitive skin interface for the first time: The Thermosensing device.

Credit: UCO